
University of New South Wales, Sydney Australia
Australian Research Council Industry Fellow (July 2023 – current)
Senior Research Fellow at The University of New South Wales, Sydney Australia (May 2021 – current)
Head of Quantum Device Fabrication at IQM Quantum Computers, Finland (Jun 2019 – March 2021)
Senior Scientist at Microsoft Quantum, Sydney Australia (Jun 2018 – May 2019)
Research Fellow at The University of New South Wales, Sydney Australia (Oct 2015 – Jun 2018)
Research Fellow at The National University of Singapore, Singapore (Oct 2012 – Sep 2015)
Postdoctoral Research Fellow at The University of New South Wales, Sydney Australia (Sep 2011 – Jul 2012)
Australian Research Council Industry Fellowship Scheme (Mid-Career) Round 1 2023
Project Description:
Scalable semiconductor quantum processor with flip chip bonding technology. Australia is famous for quantum computing research based on electron spin in silicon quantum dot. This project aims to enable the manufacturing of such scalable quantum processor. Currently, superconducting quantum processor has reached >100 of qubits by the utilization of 3D integration fabrication technology such as flip chip bonding. Likewise, for semiconductor spin-qubit to grow, it is inevitable that novel 3D architecture by expanding the building block to the next dimension must be explored to pave the way to scalable semiconductor quantum processor. This project will spearhead Australia's semiconductor quantum processor to the realm of hundreds of qubits and put this technology on par with superconducting quantum processor.